Flake copper powder is processed by ball milling to form flake like flat particles, which have a unique morphology compared to spherical copper powder and possess multiple outstanding properties.
Superior conductivity
Particles overlap with each other through surface contact, making it easier to establish a continuous conductive path. Under the same addition ratio, the conductive effect is better than that of spherical copper powder. It is widely used in conductive pastes and adhesives, and can replace some silver powder to control production costs.
Excellent electromagnetic shielding effect
Flat structures have a larger specific surface area and can effectively reflect and attenuate electromagnetic waves, making them key fillers for electromagnetic shielding coatings and conductive polymer materials.
Excellent covering and film-forming properties
Thin sheets can be laid parallel to the surface of the coating, stacked densely, with strong covering power, enhancing the density of the paint film, combining metal decorative effect and anti-corrosion performance, suitable for copper gold ink and metal topcoat.
Good thermal conductivity
The sheet-like overlapping structure is conducive to heat conduction and can be added as a thermal conductive filler to composite materials to enhance overall thermal conductivity.
Dispersion adjustable, strong processing adaptability
Rich particle size specifications, capable of surface antioxidant modification, stable dispersion in resin and solvent systems, suitable for low-temperature production processes of various inks and coatings.